The Two-Phase Direct-to-Chip Non-Condensable Gas Removal Systems Market is projected to expand from USD 621.2 million in 2026 to USD 2,262.8 million by 2036, registering a 13.8% CAGR during the 2026 to 2036 forecast period.
Demand for two-phase direct-to-chip non-condensable gas removal systems is rising as AI infrastructure increases thermal loads at the rack level and drives data centers toward higher-density liquid cooling architectures. The International Energy Agency reported that data-center electricity demand rose 17% during 2025, while AI-focused facilities recorded faster growth. Higher rack loads increase the installed base of cooling loops that require controlled evacuation, pressure management, and non-condensable gas removal.
Data-center expansion and site development are also influencing cooling system decisions. France's Ministry of Economy identified 28 additional data-center sites in May 2025 following 35 announced in February. In hotter regions such as Saudi Arabia and the UAE, operators are assessing cooling systems alongside critical power and cooling infrastructure to address heat rejection, water consumption, refrigerant compatibility, purge location, and commissioning requirements.
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Global Segment Leaders
• Direct-to-Chip Liquid Cooling – 44.0%: High processor heat flux and closed refrigerant circuits make gas management an important part of chip-level thermal performance.
• Dry Coolers – 29.0%: Warmer secondary loops can support outdoor heat rejection without routine evaporative water consumption, making dry coolers relevant for water-conscious AI facilities.
• 251-500 kW Rack Density – 34.0%: This rack-density band carries sufficient thermal duty to require formal refrigerant controls, pressure monitoring, and documented service procedures.
• Hyperscale AI – 48.0%: Standardized AI server fleets multiply the value of repeatable refrigerant charging, gas diagnostics, commissioning, and maintenance procedures.
FMI Principal Consultant Sudip Saha said, “A cooling OEM earns the NCG-control contract by proving stable condenser pressure during initial charging and every later circuit opening. Hyperscale operators should price service ownership alongside hardware cost since an inexpensive purge module can shift commissioning responsibility back onto the site team.”
Country-Level Performance
• Saudi Arabia | 15.1% CAGR: Concentrated greenfield AI capacity and hot ambient conditions encourage data-center developers to evaluate high-density cooling and heat-rejection systems during early campus planning.
• UAE | 14.8% CAGR: Large-scale AI campus development is creating demand for standardized cooling architectures that can be replicated across multiple construction phases while maintaining consistent commissioning procedures.
• South Korea | 14.4% CAGR: Domestic AI infrastructure and server-platform development are increasing the importance of cooling qualification within broader computing infrastructure programs.
• Japan | 14.1% CAGR: Data-center siting increasingly links power, telecommunications, and cooling infrastructure planning, supporting earlier consideration of refrigerant compatibility and service requirements.
• United States | 13.8% CAGR: Hyperscale and colocation development, combined with an established data-center base, supports both new-build and retrofit demand for high-density cooling systems.
Regional Context
Saudi Arabia records the highest CAGR among the five specifically profiled countries at 15.1%, while the UAE follows at 14.8%. South Korea and Japan represent important East Asian markets, while the United States provides a substantial market supported by hyperscale, colocation, and retrofit activity.
Gulf markets are increasingly relevant to high-density AI infrastructure because hotter ambient conditions place greater emphasis on efficient heat rejection and water-conscious cooling approaches. The UAE and Saudi Arabia are also developing large-scale AI and data-center campuses where standardized rack and cooling architectures can be repeated across expansion phases.
The full report provides country-level CAGR analysis across North America, Latin America, Europe, East Asia, South Asia and Pacific, and Middle East and Africa, with 20+ countries included in the complete analysis.
Competitive Landscape
The companies profiled in the Two-Phase Direct-to-Chip Non-Condensable Gas Removal Systems Market include Accelsius, ZutaCore, Parker Hannifin, Chemours, ASRock Rack, Foxconn, Compal Electronics, and Valeo.
Competition centers on two-phase cooling platform ownership, rack and loop integration, refrigerant and fluid compatibility, pressure monitoring, non-condensable gas management, service procedures, and geographic reach. Accelsius and ZutaCore participate in two-phase direct-to-chip cooling architectures, while ASRock Rack, Foxconn, and Compal Electronics integrate advanced cooling systems into server and rack platforms. Parker Hannifin and Valeo provide loop and thermal-management capabilities, while Chemours contributes fluid and chemistry expertise relevant to two-phase cooling applications.
The market is increasingly influenced by the need to control purge points, refrigerant charging, pressure diagnostics, and service responsibility within validated cooling architectures. As AI racks become denser, cooling OEMs and data-center operators are evaluating gas-removal functions as part of the broader commissioning and maintenance process rather than as an isolated component.
Recent developments also demonstrate the growing integration of two-phase cooling into AI infrastructure. Accelsius has expanded its NeuCool platform for high-density AI applications, while ZutaCore has developed two-phase cooling and coolant-distribution solutions for large-scale data-center deployments. Chemours has also pursued advanced liquid-cooling applications, including two-phase direct-to-chip and immersion configurations.
The market is supported by the expanding installed base of high-density AI racks. However, independent NCG hardware can face qualification barriers because changes to a closed refrigerant circuit may affect seal materials, purge placement, pressure management, warranty ownership, and commissioning procedures. Integrated pressure monitoring and purge-event records represent an opportunity for suppliers seeking to turn gas management into a repeatable OEM control and service function.
Two-Phase Direct-to-Chip Non-Condensable Gas Removal Systems Market – Key Market Dynamics
Driver: Higher AI rack heat loads are pushing more deployments toward two-phase direct-to-chip cooling systems where refrigerant condition and condenser pressure directly affect cooling performance.
Restraint: Standalone gas-removal hardware changes the working-fluid circuit and may require OEM approval for seal materials, purge locations, pressure interfaces, and warranty responsibility.
Opportunity: Integrated pressure monitoring, gas diagnostics, and purge-event records can create repeatable commissioning, maintenance, and retrofit service opportunities for cooling OEMs.
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